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Volume 2, Issue 10
December 2002


In This Issue
The Heart of Tissue Engineering

New DNA Detectors Bridge the (Nano)Gap

Stress-Free Engineering

Diving Into An Ocean Of Storage

Berkeley Engineering History: Wilbur Somerton and MESA

Dean's Digest

Archives 2002
2001

Lab Notes, Research from the College of Engineering


Stress-Free Engineering
by David Pescovitz

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Robert O. Ritchie

Materials Science professor Robert O. Ritchie. Click for larger image.
Courtesy Robert O. Ritchie

"The whole basis of my research is looking at why things break," says Professor of Materials Science Robert O. Ritchie.

The most recent structures he's studying can't be seen without a scanning electron microscope though. Ritchie and his colleagues are working to understand why tiny electromechanical machines, most invisible to the naked eye, are more prone to failure than engineers have expected.

Fabricated en masse from silicon, similar to the way integrated circuits are made, microelectromechanical systems (MEMS) are integrated into an increasing number of devices — from sensors that trigger auto airbag deployment after a collision to inkjet printers to medical drug delivery systems. Each gear, actuator, or motor that make of a MEMS chip is often smaller in diameter than a human hair.

on-chip resonant fatigue device

On-chip resonant fatigue device used to evaluate the fatigue endurance of silicon films used in microscale devices. Click for larger image.
Courtesy Robert O. Ritchie

"MEMS may be small, but they're structures just like airplanes, ships, or bridges," says Ritchie, who also heads the structural materials research efforts at Lawrence Berkeley National Laboratory. "If you want to make a structure out of something that will last, silicon is often right at the bottom of the list because it's so extremely brittle."

That brittleness means that the micron-thick silicon films that make up MEMS components should simply fail at the maximum stress they're capable of withstanding, not unlike window glass. But several years ago, investigators reported that the silicon films oddly suffer what's known as fatigue failure. Essentially, the material doesnít fail immediately but rather after millions and millions of cycles at stresses which can be as low as half the stress that would break the structure in a single cycle. The curiosity of Ritchie and his former graduate student Christopher Muhlstein's was piqued.

"With silicon, such fatigue failure simply shouldn't happen," Ritchie says. "But it did."

cracks in resonant fatigue device

This electron microscopy image of a section of Ritchie's resonant fatigue device (photo above left) shows cracks forming in the oxide layer on top of the silicon film. Click for larger image.
Courtesy Robert O. Ritchie

To get a better sense of what actually was occurring in the microworld, Ritchie and Muhlstein used a 300 micron square MEMS resonator, a structure that electrostatically flaps back and forth 40,000 times a second. The resonator serves as both a sample and a machine to test the sample. By electronically measuring the change in the resonant frequency of the device, the frequency at which certain electrical variables become equal, they were able to show that the fatigue failure was associated with nanometer-scale cracks that were growing in the component until they were long enough to completely break the device. Moreover, they were able to estimate the actual size of these tiny cracks and their velocities.

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To find out why these cracks were growing, Ritchie and Muhlstein turned to Eric Stach at the National Center for Electron Microscopy. With Stach's collaboration, the researchers used the Center's state-of-the-art 1-million volt electron microscope to show that the cracks were not growing in the 2000 nanometer thick silicon film itself, but rather the 100 nanometer thick oxide layer that formed on top of the silicon as a result of exposure to air, similar to rust forming on unprotected steel. Once the oxide layer forms, moisture in the air can cause cracking. And therein lay the answer to the mysterious fatigue failure.

"When you have a very thin film of silicon, the oxide layer where the moisture-induced cracking can occur is a very large portion of the whole structure," Ritchie explains. "So the crack can grow long enough in the oxide to break the whole structure. With large sections of bulk silicon, this would not occur."

Currently, Ritchie and his colleagues are collaborating with Berkeley Chemical Engineering professor Roya Maboudian to utilize her coatings to bond directly to the surface of the silicon and prevent the oxide layer from forming. The coatings, Ritchie says, are effective surface barriers to keep out air and moisture, thereby markedly reducing the possibility of fatigue failure in the silicon films.

"Metals are expected to fatigue and therefore one knows that you have to take care of it, either by design or choice of material," Ritchie says. "Fatigue of micron-scale silicon was unexpected. But it's essential to know about and understand it from the perspective of being able to design safe silicon micro-machines and structures."


Related Sites

The Ritchie Group

The Maboudian Group


Lab Notes is published online by the Public Affairs Office of the UC Berkeley College of Engineering. The Lab Notes mission is to illuminate groundbreaking research underway today at the College of Engineering that will dramatically change our lives tomorrow.

Editor, Director of Public Affairs: Teresa Moore
Writer, Researcher: David Pescovitz
Designer: Robyn Altman

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© 2002 UC Regents. Updated 11/26/02.